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Class [007]
Machinery Products

Semiconductor substrates manufacturing machines; semiconductor manufacturing machines; electronic component feeder machines for processing electronic components of electronic circuits used in electronic circuit board manufacturing machines; machines for manufacturing electronic parts; mounting machines specifically adapted for mounting electronic components of light-emitting diodes (LEDs) during the manufacturing of semiconductor devices; power operated automatic mounting machines that automatically mount electronic parts, namely, integrated circuit chips, to printed wiring circuit boards; manufacturing machines for memory chips; manufacturing machines for laminated semiconductor chips; power operated machines that mount integrated circuit chips to circuit boards; transfer machines for semiconductor chips, namely, machines specifically adapted for transferring electronic components of light-emitting diodes (LEDs) from one substrate to another via laser beam; processing equipment for semiconductor wafer; laser processing machines for processing glass pieces; laser processing machines for processing plastics; laser processing machines for processing ceramics; laser processing machines for processing printed circuit boards; machines for processing printed circuit boards; laser processing machines for processing circuits or chips as parts of semi-conductors; semiconductor and printed circuit board manufacturing machines using laser; machines for peeling electronic components from substrate boards by irradiating the electronic components laminated on the substrate with laser; substrate restraining jig for semiconductor manufacturing machines; laser lift-off machines used for stripping chip parts; manufacturing equipment and machines used for the production of micro-LED displays; replacement parts for all of the aforementioned goods