REGISTERED
on 08 Mar 2022
Last Applicant/ Owned by
1209 ORANGE STREET
WILMINGTON
DE
19801
Serial Number
88719666 filed on 09th Dec 2019
Registration Number
6667339 registered on 08th Mar 2022
Correspondent Address
Cynthia Johnson Walden
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
CMC MATERIALS
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the Read More
Classification Information
Class [007]
Machinery Products
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
First Use Date in General
19th May 2021
First Use Date in Commerce
19th May 2021
Class [003]
Cosmetics and Cleaning Products
Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
First Use Date in General
17th May 2021
First Use Date in Commerce
17th May 2021
Class [001]
Chemical Products
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
First Use Date in General
24th May 2021
First Use Date in Commerce
24th May 2021
Mark Details
Serial Number
No 88719666
Mark Type
No Service/Collective Mark
Attorney Docket Number
No 461010763001
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Design Code(s)
26.17.02 -
Wavy line(s), band(s) or bar(s)
26.17.04 -
Vertical line(s), band(s) or bar(s)
Legal History
| Status Date | Action Taken |
|---|---|
| 18th Oct 2023 | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
| 09th Aug 2023 | TEAS CHANGE OF OWNER ADDRESS RECEIVED |
| 09th Aug 2023 | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED |
| 09th Aug 2023 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| 09th Aug 2023 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| 09th Aug 2023 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| 08th Mar 2022 | REGISTERED-PRINCIPAL REGISTER |
| 02th Feb 2022 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
| 01st Feb 2022 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| 01st Feb 2022 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |