REGISTERED
on 08 Oct 2024
Last Applicant/ Owned by
Minami-ku, Kyoto-shi Kyoto 601-8366
JP
Serial Number
79364266 filed on 27th Jul 2022
Registration Number
7525561 registered on 08th Oct 2024
Correspondent Address
Shintaro Yamada
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
BONDTECH
Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of positioning devices for semiconducto Read More
Classification Information
Class [037]
Construction and Repair Services
Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of positioning devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of control devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of machines for nanoimprint lithography (NIL) for semiconductor manufacturing, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of equipment for cleaning microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of cleaning devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of wafer foreign matter inspection devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of plasma etching machines, and providing information related thereto; repair and maintenance of semiconductor exposure devices, and providing information related thereto; repair and maintenance of semiconductor cutoff devices, and providing information related thereto; repair and maintenance of semiconductor polishing devices, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor etching devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of semiconductor drying devices, and providing information related thereto; cleaning of machines and apparatuses for semiconductor manufacturing; cleaning of semiconductor manufacturing equipment; installation work of semiconductor testing equipment, and providing information related thereto; installation work of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto; installation work, repair, and maintenance of computer hardware, and providing information related thereto; none of the aforementioned services being intended for 3D printers or for machines for moulding plastics, or parts thereof
First Use Date in General
N/A
First Use Date in Commerce
N/A
Class [007]
Machinery Products
Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; machine couplings and transmission components and machine elements in the nature of shock prevention devices for semiconductor manufacturing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and semiconductor exposure apparatuses for use in manufacture, and structural components thereof; positioning devices for semiconductor manufacturing equipment, namely, ball transfer units, and components thereof, namely, bearings, as parts of machines; hydraulic and pneumatic controls for semiconductor manufacturing equipment, and components thereof, namely, hydraulic valves being parts of machines, and oil-water separators for pneumatic controls being parts of machines; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines and exposure apparatuses for use in manufacture; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; machines for nanoimprint lithography (NIL) for semiconductor manufacturing; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing and marking machines and components and appendages in the nature of parts thereof; equipment for cleaning microelectromechanical systems (MEMS), namely, dust removing installations for cleaning purposes, and components and appendages in the nature of parts thereof; cleaning devices for semiconductor manufacturing, namely, cleaning machines for semiconductor manufacturing machines; devices in the nature of machines for mounting IC chips on circuit boards; plasma etching machines; semiconductor exposure devices, namely, apparatus for use in manufacture; semiconductor cutting devices being parts of machines; semiconductor polishing devices being parts of machines; semiconductor plating devices being parts of machines; semiconductor etching devices being parts of machines; semiconductor thin-film formation devices being parts of machines; none of the aforementioned goods being 3D printers or machines for moulding plastics, or parts or fittings thereof
First Use Date in General
N/A
First Use Date in Commerce
N/A
Mark Details
Serial Number
No 79364266
Mark Type
No Service Mark
Attorney Docket Number
No SY7AK-06-TM
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
Yes
66A Current
Yes
Current Basis
No
No Basis
No
Design Code(s)
26.03.02 -
Plain single line ovals
Legal History
| Status Date | Action Taken |
|---|---|
| 08th Oct 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| 08th Oct 2024 | REGISTERED-PRINCIPAL REGISTER |
| 17th Aug 2024 | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB |
| 31st Jul 2024 | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB |
| 31st Jul 2024 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
| 23rd Jul 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| 23rd Jul 2024 | PUBLISHED FOR OPPOSITION |
| 03rd Jul 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| 20th Jun 2024 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| 17th Jun 2024 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |