on 23 Apr 2024
Last Applicant/ Owned by
2 YISHUN AVENUE 7
SINGAPORE
SG
768924
Serial Number
90156569 filed on 03rd Sep 2020
Registration Number
7367425 registered on 23rd Apr 2024
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
Machines for laser processing of semiconductor wafers; Machines for assembly of semiconductor components; Bonding apparatus, namely, machines for bonding semiconductor components and other electronic devices; Wire bonding machines; Electronics industry equipment, namely, machines for processing, assembly, and packaging electronic components; Apparatus for semiconductor wafer handling, namely, semi Read More
Machines for laser processing of semiconductor wafers; Machines for assembly of semiconductor components; Bonding apparatus, namely, machines for bonding semiconductor components and other electronic devices; Wire bonding machines; Electronics industry equipment, namely, machines for processing, assembly, and packaging electronic components; Apparatus for semiconductor wafer handling, namely, semiconductor wafer processing equipment and machines; Machines for semiconductor wafer processing; Machines for printed circuit board processing
31st Oct 2020
31st Oct 2020
No 90156569
No Service/Collective Mark
No TE/4076-469
No
No
No
No
No
No
No
No
26.01.03 -
Incomplete circles (more than semi-circles)
26.03.03 -
Incomplete ovals
Status Date | Action Taken |
---|---|
23rd Apr 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
23rd Apr 2024 | REGISTERED-PRINCIPAL REGISTER |
16th Mar 2024 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
15th Mar 2024 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
14th Mar 2024 | STATEMENT OF USE PROCESSING COMPLETE |
14th Mar 2024 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
22nd Feb 2024 | USE AMENDMENT FILED |
22nd Feb 2024 | TEAS STATEMENT OF USE RECEIVED |
22nd Aug 2023 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
27th Jun 2023 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |