NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
record initialized not assigned to examiner
on 11 Nov 2024
Last Applicant/ Owned by
14, Gajwa-ro 30beon-gil, Seo-gu
Incheon
KR
22830
Serial Number
98846302 filed on 11th Nov 2024
Registration Number
N/A
Filing Basis
1. filed as use application
2. use application currently
Disclaimer
NO DATA
"HANMI"
Die attachment equipment for manufacturing semiconductor; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor; PICK PLACE equipment for manufacturing semiconductor; die bonding equipment for manufacturing semiconductor; electronic components placement machines and apparatus for manufacturing semiconductor; semiconductor chip mounting equipme Read More
Classification Information
Class [007]
Machinery Products
Die attachment equipment for manufacturing semiconductor; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor; PICK PLACE equipment for manufacturing semiconductor; die bonding equipment for manufacturing semiconductor; electronic components placement machines and apparatus for manufacturing semiconductor; semiconductor chip mounting equipment; semiconductor package electromagnetic shielding equipment; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor
First Use Date in General
01st Dec 2000
First Use Date in Commerce
01st Dec 2000
Mark Details
Serial Number
No 98846302
Mark Type
No Service/Collective Mark
Attorney Docket Number
No 2360-032
44D Filed
No
44D Current
No
44E filed
No
44E Current
No
66A Filed
No
66A Current
No
Current Basis
No
No Basis
No
Legal History
| Status Date | Action Taken |
|---|---|
| 11th Nov 2024 | NEW APPLICATION ENTERED |