Letters or numerals forming geometrical figures, written or typographical matter in perspectiveLettres ou chiffres formant des figures géométriques, inscriptions en perspective

27 . 1 . 6

Letters or numerals forming a circle or a circumferenceLettres ou chiffres formant un cercle ou une circonférence

29 . 1 . 4

BlueBleu

29 . 1 . 3

GreenVert

29 . 1 . 8

BlackNoir

Trademark usage description

semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, chips, integrated circuits, transistors, capacitors, Read More

Classification Information

Class [009]
Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, chips, integrated circuits, transistors, capacitors, filters, oscillators, switches, resistors, amplifiers, and memories; semi-conductor wafers; semi-conductors; silicon wafers and semiconductors for integrated circuits and transfer of layers; semiconductor wafers for light-emitting diodes, radio frequency (RF) components and for power components; substrates for micro-electronics, opto-electronics, micro-engineering, light-emitting diodes, micro-systems, photovoltaics, integrated optical guides, sensors, integrated circuits, radio frequency (RF) and power components, namely, chips, integrated circuits, transistors, capacitors, connectors, filters, oscillators, switches, resistors, amplifiers, and memories

Classification kind code

Class [040]
Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser annealing, oxidation, implantation, porosification, grinding, deposition, epitaxy, and bonding of material surfaces namely metal surfaces, silicon wafers, semiconductors, piezoelectric materials, mineral insulating oxides and diamond; treatment of substrates namely metals, semiconductors, piezoelectric materials, mineral insulating oxides and diamond , by means of polishing, grinding, cleaning, laser irradiation, plasma treatment, amorphization, re-crystallization, etching, chemical etching, plasma etching, carbonization, smoothing by means of plasma, cleaning or thermal treatment, plasma activation, and hydrophilization for micro-electronics, opto-electronics, piezoelectric, photovoltaics, microsystems and radio frequency (RF) components; treatment of semiconductor wafers and semiconductors by means of laser beams, plasma, anneal, and cleaning; polishing of semiconductor wafers, transfer of layers of crystalline materials by report on a wafer, semiconductors and components of semiconductors on all media namely wafers, substrates used in micro-electronic, circuit boards, semiconductor chips, devices; treatment of silicon wafers and semiconductors by means of laser beams, plasma, anneal, and cleaning; polishing of silicon wafers and semiconductors, transfer of layers of materials by report namely by exfoliation on a wafer

Classification kind code

Class [042]
Scientific, technological, technical and industrial research in the field of material science for microelectronics, opto-electronics, piezo electronics and micro-engineering, photovoltaics, microsystems and radio frequency (RF) components provided by engineers; testing of materials; laboratory work for others, namely, materials testing and scientific research and development in the field of material science; research and development of new products for others; scientific research and development in the field of wafers and semiconductors for opto-electronic and piezo electronics components, photovoltaics, radio frequency (RF) components, power components, micro-engineering, and micro-systems; scientific research and development in the field of silicon wafers and semiconductors for integrated circuits and derived activities namely research and development in the field of electronic components namely semi-conductor chips, semiconductor wafers, semi-conductors, electronic chips for the manufacture of integrated circuits; scientific research and development in the field of the transfer of micro-electronic circuits and micro-systems on all media engineering and engineering services in the field of semiconductor wafers and semiconductors for micro-electronic, opto-electronic, piezo-electronic radio frequency (RF), micro-mechanical, photovoltaic components, memories, power components; engineering and engineering services in the field of silicon wafers, semiconductors for integrated circuits and derived activities namely research and development in the field of electronic components namely semi-conductor chips, semi-conductor wafers, semi-conductors, electronic chips for the manufacture of integrated circuits and research and development in the field of transfer of micro-electronic and opto-electronic circuits and micro-systems on all types of media namely semi-conductor chips, semi-conductor wafers, semi-conductors, electronic chips, circuit boards for the manufacture of integrated circuits; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, memories, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems; assistance and technical support, namely, technical advice in the field of development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems

Classification kind code

Mark Details

Serial Number

1881425

Mark Type

Trademark

Legal History

Action Taken	Status
Submitted for opposition 42 on 07^th Oct 2020	Advertised
Submitted for opposition 27 on 11^th Sep 2020	Approval Notice Sent
Submitted for opposition 26 on 11^th Sep 2020	Approved
Submitted for opposition 22 on 07^th Aug 2019	Search Recorded
Submitted for opposition 20 on 07^th Aug 2019	Examiner's First Report
Submitted for opposition 67 on 05^th Sep 2018	Agent Name Changed
Submitted for opposition 68 on 05^th Sep 2018	Rep for Service Name Changed
Submitted for opposition 31 on 07^th Feb 2018	Formalized
Submitted for opposition 1 on 06^th Feb 2018	Created
Submitted for opposition 30 on 05^th Feb 2018	Filed