About 6 Trademarks found for “soitec”

The mark consists of the stylized word "SOITEC" appearing in black font with the "O" formed by three ovals with pointed ends. The ovals are blue, green, and black. The color grey represents background and is not a feature of the mark.

Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser annealing, oxidation, implantation for layer exfoliation, grinding, chemical and physical layer deposition in the nature of electrophoretic coating services, epitaxy, and bonding of material for layer transfer; Treatment of substrates by means of glass substrate polishing, grinding, chemical treatment of surface to remove particles and/or contaminants, laser irradiation, plasma treatment in the nature of applying plasma finishes, amorphization, re-crystallization, etching, chemical etching, plasma etching, carbonization, smoothing by means of plasma, heat treatment, plasma activation to hydrophilize surfaces, and hydrophilization for micro-electronics, opto-electronics, piezoelectric, photovoltaics, microsystems and radio frequency (RF) components; treatment of semiconductor wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of semiconductor wafers, transfer of layer by exfoliation; treatment of silicon wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of silicon wafers and semiconductors, transfer of layer by exfoliation

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, SPLITTING AND ALL TREATMENT USED IN THE SEMICONDUCTOR INDUSTRY

SILICON WAFERS; SEMICONDUCTORS; SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; COMPONENTS FOR MICROELECTRONIC PURPOSES AND MICRO-MECHANIC PURPOSES, NAMELY, SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; MATERIAL SUBSTRATES FOR MICROELECTRONICS AND MICRO-MECHANICS, NAMELY, ELECTRO-OPTICAL FILM OR SEMICONDUCTORS SUBSTRATES FOR USE IN THE MANUFACTURE OF FLAT PANEL DISPLAYS, INTEGRATED OPTICAL WAVE GUIDES, SENSORS, INTEGRATED CIRCUITS CARDS AND SMART CARDS AND MAGNETIC IDENTITY CARDS; CONDUCTOR SILICON WAFERS FOR MICRO-MACHINING APPLICATIONS

Treatment of materials, namely, mechanical, chemical and physical treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits and machining and gluing of material surfaces; treatment of substrates for microelectronics and optoelectronics, photovoltaics and micromechanics and all derived activities; treating semiconductor wafers and semiconductors; burnishing by abrasion of semiconductor wafers; applying finishes to semiconductors, namely, transfer of layers of materials, semiconductors or components on any media; treating silicon wafers and semiconductor wafers; [ magnetization of semiconductor materials substrates and silicon wafers; ] burnishing by abrasion of silicon wafers and semiconductor wafers; applying finishes to silicon and semiconductors, namely, transfer of layers of silicon, semiconductors or components on all media [ production of solar power ]

Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activities; blank [ magnetic, ] optical and digital [ and electronic ] recording media; semiconductor wafers; semiconductors; silicon and semiconductor wafers for printed circuits, [ integrated circuits and derived activities; ] components for microelectronics, micromechanics and optoelectronics, namely, silicon wafers and semiconductors for printed circuits and integrated circuits; semiconductor wafers for light-emitting diodes, radiofrequency (RF) components and power components; substrates for microelectronics, optoelectronics and micromechanics, for flat screens, light-emitting diodes, integrated optical guides, sensors, integrated circuit cards being smart cards, radiofrequency (RF) and power components, namely, electro-optical film or semiconductor substrates for use in the manufacture of flat panel displays, integrated optical wave guides, and sensors [ integrated circuit cards and smart cards and magnetic identity cards; transistors, microelectronic circuits, Microsystems comprising micronetworks for use in the design of integrated circuits; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; lasers, not for medical purposes; diodes, photodiodes, light-emitting diodes, laser diodes, high performance semiconductor laser diodes, photodiode detectors, optical conductors in the nature of waveguide conductors, photocouplers, optical sensors, light-emitting diode units; light gathering apparatus and devices combined with solar cells for producing electricity, namely, photovoltaic cells and solar collector sold as a unit; light gathering apparatus and devices combined with solar cells for producing energy, namely, photovoltaic cells and solar collector sold as a unit; solar cells for producing electricity; solar cell modules for producing electricity; solar energy installations being solar panels for producing electricity; solar cells; solar cells for household use; solar cells for industrial use; photovoltaic cells and modules for producing electricity as well as installations consisting thereof, namely, solar modules for production of electricity, solar thermal and electric receivers, tracking mechanisms and concentrating optics and control algorithms; inverters for photovoltaic applications ]

SCIENTIFIC, TECHNOLOGICAL, TECHNICAL AND INDUSTRIAL RESEARCH IN THE FIELD OF MICROELECTRONICS; MATERIAL TESTING SERVICES FOR OTHERS; LABORATORY RESEARCH IN THE FIELD OF MICROELECTRONICS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS; ENGINEERING AND SURVEYING IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, SPLITTING AND ALL TREATMENT USED IN THE SEMICONDUCTOR INDUSTRY

The three (3) smaller circles on the periphery and partially hidden by the larger white circle are colored blue.

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, SPLITTING AND ALL TREATMENT USED IN THE SEMICONDUCTOR INDUSTRY

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF MECHANICAL, PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, CHEMICAL-MECHANICAL-POLISHING TREATMENT AND ALL TREATMENT USED IN THE SEMI CONDUCTOR INDUSTRY