About 30,000 Trademarks found for “rozhnov evgeny”

Camisoles; Chemises; Corsets; Ladies' underwear; Lingerie; Loungewear; Panties, shorts and briefs; Sleep masks; Slips; Tank tops

Awnings comprised primarily of tensile fabric membranes; Awnings for vehicles of textile or synthetic materials; Awnings of textile; Awnings of textile or synthetic materials; Bed tents; Canvas tarpaulins; Unfitted covers for boats and marine vehicles; Unfitted vehicle covers; Vehicle covers, not fitted

Photography services

The mark consists of the stylized word "ROZHOME" with the letter "O" being displayed as a shaded circle containing a portion of a couch.

Scientific apparatus and instruments for microelectronics, biotechnology, microsystem techniques, semiconductor and nanotechnology, namely, exposure systems for 1X lithography applications, namely, mask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanently, namely, substrate bonding systems comprised of UV-radiation/UV-light source devices, heaters, and pneumatic and hydraulic piston setups and spindles; systems for the application of coatings to work pieces, namely, resist coaters, developer systems for developing lithographically structured layers, namely, resist developers, imprinting systems used to imprint pattern onto surfaces on work pieces, namely, imprint lithography systems comprised of one or more of the following components, alignment stages for substrate to stamp alignment suitable for a single step or step and repeat alignment, means to apply imprinting force, means to cure the imprint resist such as a UV- light source and heaters, measurement apparatus that can detect the relative position of the stamp versus the substrate and provide the input for the alignment procedure; lamination equipment used to coat surfaces with tape like materials; surveying instruments; electric, photographic, optical, measuring, signal, and monitoring devices, namely, precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology, namely, front to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopes, metrology systems comprised of one or more of the following, infrared light source devices for infrared inspection of the bonding interface, infrared detectors to detect the infrared light passing through the bond interface, ultrasonic transducers and detectors, x-ray transducers and detectors, visible light light-sources and cameras, microscope setups, computer hardware and operating software for data analysis for the inspection of wafer bonding interfaces; overlay accuracy measurement systems comprised of optical detection devices, namely, microscopes and lasers to detect the positions of two patterns in reference to each other, computer hardware for data analysis and collection, as well as mapping; critical dimension metrology systems comprised of optical detection devices, namely, microscopes and lasers to detect the two or more features of a specific pattern on the wafer and allow for calculation of the distance between them, as well as a computer hardware for data analysis, collection and mapping; pressure uniformity metrology apparatus; apparatus for analysis, namely, front to backside alignment accuracy measurement system comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware and software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; [ semiconductor chips, integrated circuits; ] computer operation programs; [ peripheral equipment for computers; ] data processing units, data processors and computer hardware; computer software related to the analysis of lithography results, software for the analysis of wafer bonding results, aligning software; scientific diagnosis devices in bio-chip format, namely, oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial substance libraries on chip surfaces for scientific purposes; [ remote controls for electric systems for remote controlled industrial operational processes, namely, laboratory robots; ] electric control panels for manufacturing facilities for microelectronics, medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology; [ filters and masks for photographic and photolithographic equipment; telescopes; telephones; semiconductors; ] monitoring devices, namely, oscillographs, indicators, surveying instruments; [ data processing coupler; special furniture for laboratories; ] laser for non-medical purposes; [ reading devices for processing electronic data; ] measuring instruments and measuring devices, namely, laser measuring devices; material testing instruments and machines, namely, machines for testing bonding strength in bonded substrates, front to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detect a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware and related software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopes, metrology systems comprised of one or more of the following; infrared light source devices for infrared inspection of the bonding interface, infrared detectors to detect the infrared light passing through the bond interface, ultrasonic transducers and detectors, x-ray transducers and detectors, visible light light-sources and cameras, microscope setups, computer hardware and related software for data analysis for the inspection of wafer bonding interfaces; optical apparatus and instruments, namely, microscopes; photographic apparatus and instruments, namely, cameras; [ video projectors; controlled volume pumps; protective clothing, in particular for clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; photographic range finders ]

The mark consists of the color dark grey appearing in the wording "EVG" and in the design in the middle of the ellipse. The color yellow fills in the ellipse around the design element.

WIRE MESH COILING MACHINES, WIRE STRAIGHTENING MACHINES, AND SHEARS

RESISTANCE WELDING MACHINES

Machines and structural parts therefor, for the production, treatment, transport and processing of electronic components, especially semiconductors, in the field of microelectronic, medical technology, biotechnology, semiconductor technology and microsystems technology; machines and structural parts therefor, for the production, treatment and processing of semiconductors; machines and structural parts therefor, for treatment of surfaces of electronic components, especially wafers

Computer motherboards; Central processing unit (CPU) coolers; Power supplies for gaming computers

Game controllers in the nature of keyboards for computer games; Gaming mice

The wording "EVGW" has no meaning in a foreign language.

Computer hardware and computer software programs for the integration of text, audio, graphics, still image and moving pictures into an interactive delivery for multimedia applications