About 30,000 Trademarks found for “mccampbell & company inc”

sportswear; namely, hats, ski jackets, sweat suits, T-shirts, shorts, long pants, jackets, and accessories; namely, socks and belts

Administration services for insurance and annuities

Platform as a service (PAAS) featuring computer software platforms for use in database management for use in underwriting of life, annuity, security, retirement, health, disability, property, and casualty insurance products; Software as a service (SAAS) featuring computer software platforms for use in database management for use in underwriting of life, annuity, security, retirement, health, disability, property, and casualty insurance products

PROVIDING TEMPORARY, PERMANENT AND CONTRACT EMPLOYMENT PLACEMENT SERVICES AND PROVIDING INFORMATION ON EMPLOYMENT, CAREERS AND TEMPORARY STAFFING THROUGH A GLOBAL COMPUTER NETWORK

Media editing and production

The mark consists of the letters "M" and "C" with the right side of the letter "M" and the left side of the letter "C" overlapping, and with the number "2" as an exponent, with a shaded square behind the right side of the joined letters. Below the letters and shaded square is a horizontal line above the wording "AN MCH COMPANY".

The mark consists of the letters "M" and "C" with the right side of the letter "M" and the left side of the letter "C" overlapping, and with the number "2" as an exponent, with a shaded square behind the right side of the joined letters. Below the letters and shaded square is a horizontal line above the wording "AN MCH COMPANY".

"COMPANY, INC."

The mark consists of a design element which includes a rectangle with a "Z". Beneath the design are the words "ZEE COMPANY, INC".

The mark consists of the capital letter "H" with the capital letter "C" superimposed on the right hand side of the H. The letters "HC" are green on a white background.

"& COMPANY"

Interior design services including space planning, furniture selection, material and surface selection

multichip modules and electronic packaging; namely, interconnection substrates, packages and heat sinks