About 45 Trademarks found for “si* s”

Machines for plasma surface treatment; machines for chemical surface treatment; machines for large area coating using sputter deposition, namely horizontal or vertical or tilted sputtering deposition and machines for vacuum deposition for coating of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric ,transparent and electrically conductive or passivating layers, in particular using physical or chemical vapour deposition; machines, namely, physical or chemical vacuum deposition machines for coating planar and three-dimensional substrates and machines for multi-layer vacuum deposition for coating of metals and ceramics; machines for vacuum deposition for coating of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent and electrically conductive or passivating layers, in particular using physical or chemical vapour deposition on substrates; machines for large area coating using vacuum deposition, namely horizontal or vertical or tilted sputtering deposition for vacuum deposition for coating of metal, metal alloys, metal oxides or metal nitrides; machines for the production of optical storage media and optical storage discs for high-definition and ultra-definition resolution content for vacuum deposition for coating of metals, metal alloys, metal oxides or metal nitrides; machines for vacuum deposition for coating of metals, metal alloys, phase transition ceramics or semiconductors; combinations of machines for automation of substrate handling and processing for the refinement of planar and three-dimensional substrates namely for vacuum deposition for coating of metals, metal alloys, metal oxides, or metal nitrides semiconductors; machines for cleaning glass or silicon substrates; in-line machines for cleaning thin-film solar cells; machines for cleaning of substrates, namely, semiconductor and glass wafers and machines for cleaning for single side and double side processing of glass and silicon substrates; machines for chemical cleaning of mono and multi crystalline silicon; machines for etching thin-film solar cells; machines for etching substrates, namely, semiconductor and glass wafers; in-line machines for acidic etching or alkaline etching, for single side and double side processing; machines for chemical etching of mono and multi crystalline silicon; machines for injection molding; machines for replication being manufacturing, namely manufacturing of optical discs including CD, DVD, HD-DVD and other types of optical discs and optical storage media; machines for lacquering; machines for embossing; machines for nano imprint lithography by wet embossing; machines for laser exposure changing a material from an amorphous structure into a crystalline structure; machines for photoresist developing in the nature of laser exposure or laser beam recording; machines for laser beam recording, namely, for the production of master disc for the replication of optical disc or optical storage media; machines for wet chemical treatment, namely, machines used for wet-chemical etching, cleaning, coating and drying of substrates; machines for wet chemical deposition; automated cargo handling apparatus, namely for transporting, conveying, lifting, handling, loading and packaging objects, parts, workpieces, and materials; moving and handling equipment, namely handling arms conveyors being cargo handling machines, conveyor belts and industrial robots; mechanisms for transportation, namely, pneumatic transporters; combinations of industrial machines and automated handling apparatus for performing several processes regarding treatment of materials, namely for automation of substrate handling and processing for the refinement of planar and three-dimensional substrates, namely for vacuum deposition for coating of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent and electrically conductive or passivating layers, in particular using physical or chemical vapour deposition, for surface treatment of substrates, for lacquering, namely, spray-coating of substrates with UV curable lacquer or solvent based lacquer, for UV-curing or drying; combinations of machines for manufacturing silicon solar cells, namely for automation of substrate handling and processing, for vacuum deposition for coating of transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent and electrically conductive, or passivating layers, for wet chemical treatment of substrates, for laser ablation, namely, electrical insulating, for structuring, for contact opening, for contact firing of substrates and screen print and for thermal treatment of substrates; combinations of industrial machines and automated handling apparatus for performing several processes regarding treatment of materials, namely for manufacturing thin film solar cells, namely for automation of substrate handling and processing, for vacuum deposition for coating of substrates, for wet chemical treatment of substrates, for laser ablation, namely, surface structuring, electrical insulation or cell formation of substrates, or thermal treatment of substrates and for lamination or contacting substrates; in line machine systems, namely, machines and machine tools for coating, surface treatment, thermal treatment, plasma treatment, spraying, vacuum deposition, lacquering, cleaning, etching in the nature of in-line machines for wet chemical treatment, for etching, cleaning, coating and drying thin-film solar cells or glass or silicon substrates, semiconductor devices and optical components

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Machines for the production of semiconductors; Machines for manufacturing semiconductor wafers; Semiconductor wafer processing equipment; Machines for manufacturing semiconductor plates; Semiconductor substrates manu-facturing machines; Machines for manufacturing semiconductor components; Machines for the assembly of semiconductor components; Machine tools for semiconductors and semiconductor wafers manufacturing and processing