About 1,220 Trademarks found for “lai*”

The wording "LAISATU" has no meaning in a foreign language.

The English translation of "Laibao" in the mark is "come precious treasure".

Color is not claimed as a feature of the mark.

Bras; caps being headwear; children's and infant's apparel, namely, jumpers, overall sleepwear, pajamas, rompers and one-piece garments; corsets being foundation clothing; costumes for use in role-playing games; down jackets; dress shirts; formalwear, namely, dresses, gowns, tuxedos, dinner jackets, trousers and footwear; knickers; loungewear; men's and women's jackets, coats, trousers, vests; negligees; one-piece garments for children; overcoats; shapewear, namely, girdles, bras; shoes; short-sleeved or long-sleeved T-shirts; shorts; skirts and dresses; socks; suits; suits of leather; surf wear; sweaters; sweaters for babies, adults, children, women, men; T-shirts; tops as clothing; trousers; underwear; wedding gowns

LASER; L BAND ASYMMETRIC INTELLIGENCE SURVEILLANCE AND RECONNAISSANCE

Entertainment services in the field of film and television, namely, the creation, development, production and distribution of motion picture films and television films; [ production and recording of video discs, tapes and cassettes for others; ] preparation of special effects and special effects animation services for film and video

Entertainment services in the field of film and television, namely, the creation, development, production and distribution of motion picture films and television films; [ production and recording of video discs, tapes and cassettes for others; ] preparation of special effects and special effects animation services for film and video

The wording "LAIMLE" has no meaning in a foreign language.

Microwave absorbers, namely, pastes, pads, gels, and molded / extruded shapes, comprised of foams, elastomers, and polymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive contacts, namely, fabric over foam contacts, foil over foam contacts, spring contacts, and surface mount device contacts, for providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive foam, namely, sheets, pads, strips, and die-cut shapes, for use in conducting heat and electricity; Conductive tape for electromagnetic radiation shielding in electronic products; Decorative electromagnetic interference (EMI) shielding metals, namely, conductive metal sheets having a decorative finish thereon, for EMI shielding in electronics; structural EMI shielding metals, namely, in the form of metal board level shields; EMI shielding wire mesh and knitted wire, namely, in the form of gaskets; Electromagnetic interference (EMI) shielding products, namely, EMI shielding contacts, EMI spring contacts, EMI shielding user interface shields and EMI combination shields, EMI board level shielding and customer designed EMI shielding; Electromagnetic interference shielding gaskets, namely, fabric over foam gaskets, foil over film gaskets, and fingerstocks; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics; Form-in-place non-metal gaskets for electronic devices; Vent panels, namely, metal plated rigid structures that provide EMI shielding and permit air flow to electronic components; Thermal interface materials and phase change thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermally conductive PCB (printed circuit board) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; Thermally conductive thermoplastics, namely, semiprocessed thermoplastics in molded, extruded, and sheet form; Conductive plastics and elastomers, namely, putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices

Peltier cooling and heating apparatus; Apparatus for converting thermal energy to electrical energy, namely, thermoelectric converters; thermoelectric assemblies, namely, apparatus for the conversion of electrical energy to cool, heat or temperature stabilize electronics or enclosures; thermoelectric modules, namely, semiconductor-based devices for the conversion of electrical energy to cool, heat or temperature stabilize electronics; heat exchangers not being parts of machines, namely, recirculating liquid to air heat exchangers

shoes