About 113 Trademarks found for “bu*lc”

The mark consists of a black arrow with a grey lower edge running from left to right in an upward direction, a blue and green bar graph showing upward movement from left to right, a grey and white checkered back drop to the graph beside the words "BURPEE DEL SIMONE" in black.

The mark consists of stylized red and blue arrows pointing to a red circle in the middle. The stylized words BUSINESS ACCOUNTING are featured to the left of the arrows written in blue, followed by the words "& TAX SERVICES, LLC" written in red. The entirety of the mark is featured against a white background which is not claimed as a feature of the mark.

The mark consists of the wording "BUZZ KILL" in a large stylized Black font below which is located the wording "MANUFACTURED BY ORIZON CO. LLC" in a smaller Black upper-and-lower-case font; below the letters "B" and "U" floats a gun-sight design with a stylized Black hornet with a Yellow striped tail and Gray wings centered in the crosshairs. The background of the mark appears in White.

Financial services, namely, investment management and advisory services

The mark consists of the wording "BUYER ASST LLC" and two red lines. The red lines appear under the letters "ASST" and the "LLC" is rotated 90 degrees. The color blue appears as the color of the wording. The color black appears as the outlining and shading on the wording "BUYER ASST." The color white appears as shading on the wording "BUYER ASST." The color gray appears as shadows behind the wording. The background of the mark is transparent.

BUDGET TO BEAUTIFUL DESIGNS LLC

Commodity Broker

Legal services

Substrates for semi-conductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator; SAW(Surface Acoustic Wave) and filter; leadless chip carriers; interposers for semi-conductors, namely, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, namely, protective housings working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards

Provision of financial services, namely, originating, underwriting and servicing of loans on behalf of credit unions to businesses