Machinery installation, maintenance and repair; wafer dicing machines installation, maintenance and repair.
...
Class 040
Treatment & Processing of Materials Services
Custom assembling of materials for others; dicing wafers; treatment of materials by laser beam.
Class 041
Education and Entertainment Services
Training and education services; providing education in the field of wafers or wafer dicing technologies; training in the field of wafer dicing; training in the use and operation of wafer dicing machines.
SDEStealthDicingEngineinside!HAMAMATSU
Hamamatsu Photonics K.K.
UK00906327225
Registered
Class 007
Class 007
Machinery Products
Glass working machines; semiconductor manufacturing machines and systems; cutting machines for semiconductor substrates made of sapphire, silicon, silicon carbide, glass, crystal, lithium tantalite, gallium arsenide, indium phosphide, gallium nitride or aluminum gallium arsenide and bonded wafers of these substances.
Machinery installation, maintenance and repair; wafer dicing machines installation, maintenance and repair.
...
Class 040
Treatment & Processing of Materials Services
Custom assembling of materials for others; dicing wafers; treatment of materials by laser beam.
Class 041
Education and Entertainment Services
Training and education services; providing education in the field of wafers or wafer dicing technologies; training in the field of wafer dicing; training in the use and operation of wafer dicing machines.
Glass working machines; semiconductor manufacturing machines and systems; cutting machines for semiconductor substrates made of sapphire, silicon, silicon carbide, glass, crystal, lithium tantalite, gallium arsenide, indium phosphide, gallium nitride or aluminum gallium arsenide and bonded wafers of these substances.
Glass working machines; semiconductor manufacturing machines and syste...
