Electronic insulating materials, namely, base materials in the form of glass-fabric reinforced resin for high-frequency applications such as broadcasting, workstations and servers, antennas, high speed and low loss interconnection applications, senor in extreme environments, and in the manufacture of sensors; base materials for printed circuits in form of fibre-reinforced plastic boards, and copper clad reinforced plastic boards; base materials for multi-layer circuits in form of copper clad thin laminates and prepregs (adhesive films); base materials for the manufacture of printed circuits according to the additive technique; all of the aformentioned base materials in form of semi-finished products.
Electronic insulating materials, namely, base materials in the form of glass-fabric reinforced resin for high-frequency applications such as broadcasting, workstations and servers, antennas, high speed and low loss interconnection applications, senor in extreme environments, and in the manufacture of sensors; base materials for printed circuits in form of fibre-reinforced plastic boards, and copper clad reinforced plastic boards; base materials for multi-layer circuits in form of copper clad thin laminates and prepregs (adhesive films); base materials for the manufacture of printed circuits according to the additive technique; all of the aformentioned base materials in form of semi-finished products.
