About 1 Trademarks found for “AVOID THE VOID”

Nano-materials, namely, reactive multi-layer foils, solders and sintering materials fabricated by vapor-depositing alternating nanoscale layers of Silver (Ag), Aluminum (Al) and Nickel (Ni), specialty alloys, namely, alloys principally made from gold, silver, copper, indium, gallium, germanium, titanium and palladium, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, namely, adhesives incorporating conductive particles or developing intrinsic material conductivity into a polymer matrix, electrically-conductive underfills used to fill space beneath a die and adhere to its carrier used in electronics assembly and packaging, such as flip-chip, fine pitch BGA and chip scale packaging, electrically-conductive polymers, indium-containing fabrications, and pure indium

Educational services, namely, providing a website featuring blogs and non-downloadable publications in the nature of articles, brochures, and technical papers in the fields of solders, specialty alloys, and electrically-conductive materials; educational services, namely, live and on-line classes, seminars, conferences, meetings, workshops and informal programs using on-line activities and interactive exhibits and printable materials distributed therewith in the field of developing, manufacturing, supplying, and processing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium

Technical consultation in the field of developing, manufacturing and supplying nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium; Technical consultation in the process techniques and uses of developing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium