| PCTF Remtec, Inc.
76242261 17 Apr 2001 | on 18 Jan 2023
| METALLIZED CERAMIC SUBSTRATES, NAMELY, PLATED COPPER ON THICK FILM ELE... Class 001 Class 001 Chemical Products METALLIZED CERAMIC SUBSTRATES, NAMELY, PLATED COPPER ON THICK FILM ELECTRONIC SUBSTRATES FOR USE IN THE FURTHER MANUFACTURE OF ELECTRICAL TELECOMMUNICATION, MICROWAVE, [ DATA TRANSLATION,] POWER, BIOMEDICAL EQUIPMENT, NAMELY, RF POWER AMPLIFIERS, WIRELESS COMMUNICATORS, MICROWAVE MODULES, SWITCHES, CONVERTERS, AND CHIP CARRIERS | | | AGENIG Remtec, Inc.
77629153 09 Dec 2008 | on 31 Dec 2019
| substrates primarily of metalized ceramic for electrical or thermal in... Class 017 substrates primarily of metalized ceramic for electrical or thermal insulation of power amplifiers and low noise amplifiers, optical switches, LED, filters, high density DC/DC converters, driver circuits, thermal electrical coolers, power hybrids, power modules, power packages, chip carriers and other power assemblies | | | REMTEC Remtec, Inc
75530098 03 Aug 1998 | on 15 Dec 2019
| Metallized ceramic substrates for use in the further manufacture of el... Class 001 Class 001 Chemical Products Metallized ceramic substrates for use in the further manufacture of electrical telecommunication equipment, namely, RF power amplifiers, wireless communicators [ and cable TV ] | | | ZERO PULLBACK Remtec, Inc.
77629146 09 Dec 2008 | on 25 Nov 2019
| substrates primarily of metalized ceramic, namely, ceramic submounts f... Class 017 substrates primarily of metalized ceramic, namely, ceramic submounts for electrical insulation of high power laser diodes used in optoelectronics | | | PTV Remtec, Inc.
86023505 30 Jul 2013 | on 23 Nov 2019
| primarily copper plated substrates used for electronic packaging of po... Class 006 primarily copper plated substrates used for electronic packaging of power circuits | |